LCB3399
SOC :RK3399
Storage :2+16 GB / 4+16 GB/ 4+64 GB
Size :62mm(L)*50mm(W)*7.8mm(H)
Product :The core module connects to the baseboard with two Tyco/AMP dual-row 120-pin board-to-board connectors with a 0.8mm pitch, fastened by four M2 screws. This setup is stable and reliable, and it facilitates easy installation and maintenance.

| Basic Parameters | |
| SOC | RK3399, featuring a dual-Cortex-A72 plus quad-Cortex-A53 big.LITTLE CPU structure, with a maximum clock speed of 1.8GHz. | 
| GPU | Mali-T860 GPU, supporting OpenGL ES 1.1/2.0/3.0/3.1, OpenCL; supports AFBC (Advanced Frame Buffer Compression). | 
| VPU | Supports 4K VP9 and 4K 10-bit H265/H264 video decoding, up to 60 frames per second (fps). | 
| 1080P multi-format video decoding (VC-1, MPEG-1/2/4, VP8). | |
| 1080P video encoding, supporting H.264, VP8 formats. | |
| DDR | LPDDR4 memory, with optional capacities of 2GB/4GB. | 
| eMMC | eMMC 5.1 storage, with optional capacities of 16GB/64GB. | 
| PMU | RK808 | 
| OS | Android / Ubuntu / Buildroot | 
| Hardware Specifications | |
| Camera Interface | Two ISP built-in | 
| Dual MIPI-CSI 4 Lane of 1.5 Gbps/Lane | |
| ITU-R BT 601/656 compliant | |
| Maximum input resolution of one ISP is 14M pixels | |
| Display Interface | Two VOP embedded | 
| Dual MIPI-DSI 4 Lane of 1.5 Gbps/Lane up to 2560x1600@60fps | |
| eDP1.3 4 Lane of 2.7/1.62 Gbps/lane | |
| DP1.2 4 Lane with HDCP2.2 up to 4kx2k at 60Hz resolution | |
| HDMI2.0 3 Lane with HDCP2.2 | |
| USB Interface | OTG*1,HOST*2,TYPE-C*2 | 
| TYPE-C Interface | Dual Type-C PHY with Type-C V1.1 and USB PD2.0 | 
| Attach/detach detection and signaling as DFP, UFP and DRP | |
| Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode | |
| Up to 5Gbps data rate for USB3.0 | |
| Up to 5.4Gbps (HBR2) data rate for DP1.2 | |
| Audio Interface | Two I2S/PCM built-in n up to 8 channels TX and 8 channels RX | 
| SPDIF supported | |
| Audio resolution from 16bits to 32bits | |
| Sample rate up to 192KHz | |
| Provides master and slave work mode, software configurable | |
| Support 3 I2S formats (normal, left-justified, right-justified) | |
| Support 4 PCM formats (early, late1, late2, late3) | |
| Support two 16-bit audio data store together in one 32-bit wide location | |
| Support 16, 20, 24 bits audio data transfer in linear PCM mode | |
| Connectivity | Compatible with SDIO 3.0 protocol | 
| GMAC 10/100/1000M Ethernet Controller | |
| Six on-chip SPI controllers | |
| Five on-chip UART controllers inside | |
| Eight on-chip I2C controllers | |
| Five groups of GPIO (GPIO0~GPIO4), totally have 100+ GPIOs | |
| Five-channel single-ended 10-bit SAR-ADC up to 1MS/s sampling rate | |
| Other Specifications | |
| Operating temperature | Enterprise level: -20°C to 70°C | 
| Industrial level: -40°C to 85°C | |
| PCB interface | B2B(240 Pin 0.8mm Pitch) | 
| PCB size | L* W *H(mm):62 *50 * 7.8 | 
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