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LPB3568/J

产品概述

LPB3568 智能主机是基于瑞芯微 RK3568 芯片平台精心设计的一款智能主机;机身采用全铝材料无风扇设计,机身内部通过创新性的结构组合,让关键的 CPU 和 PMU 等主要发热器件直接导热到外部铝材壳体上,使整个机身壳体全部充当了散热材料,可以耐受更严苛的工作环境并广泛应用于多种工业场景。


产品参数

Function

Description

CPU

RK3568, 22 nm, quad-core Cortex-A55, up to 2.0GHZ

GPU

ARM G52 2EE, OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, high quality 2D Graphics Engine build in

NPU

up to 10 TOPS; INT8/INT16/FP16/BFP16 MAC hybrid operation supported

VPU

4K VP9 and 4K H265 up to 60fps video decoding

1080P up to 100fps H265/H264 video encoding

8M ISP with HDR

DDR

LPDDR41GB/2GB/4GB/8GB(Optional)

eMMC

eMMC 5.18GB/16GB/32GB/64GB/128GB(Optional)

PMU

RK809

Net work

2 x 10/100/1000Mbps Ethernet;

Wi-Fi 2.4GHz/5GHz,802.11a/b/g/n/ac/ax;

BT V5.0 with BLE supported

2G/3G/4G/5G modules supported (optional)

Storage

MicroSD (TF) Card Compatible with SDIO3.0

OS

Android / Buildroot / Debian / Ubuntu

Hardware Interface

Power

DC 9V - 36V

USB

1 x Type-A USB3.0 HOST, 1 x Type-A USB3.0 OTG, 2 x Type-A USB2.0 HOST

Display output

2x Type-A HDMI 2.0, 1x VGA, 1x Duel channel LVDS

Audio

1x φ3.5mm audio out, 1xφ3.5mm microphone, 2x Speaker output with 10W@8Ω

Display input

HDMI Input interface

PCIe

1x mini PCIe for 2G/3G/4G/5G LTE module, 2 x mini PCIe for AI cards

M.2

M.2 NGFF ( M-KEY ) PCIE V2.1 x4 with NVMe SSD supported 

SD card

Compatible with SDIO 3.0 protocol, system boot up supported

SIM card

Micro sim slot for Mini-PCIe 4G LTE module

RJ-45

2 x 10/100/1000 Ethernet

Connectivity

2x Uart, 2x CAN BUS, 4x RS232, 1 x RS485

Input/output

4x Relays, 4x digital input, 4x analog input

Size

LxWxH(mm): 182x120x63


应用案例
  • 工业控制

  • 商显零售

  • 机器视觉

  • ADAS/DMS

  • 考勤

  • 功能验证

  • 研发评估

  • 多媒体显示

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